Established in 2018, I-TECH SOLUTIONS is engaged in manufacturing of Hydraulic Shearing Machine, Press Brake Machine, etc. All our manufactured products are in accordance with global quality standards
E-beam evaporation is a process similar to thermal evaporation i.e. a source material is heated above its boiling/sublimation temperature and evaporated to form a film on the surfaces that is stroke by the evaporated atoms. This evaporation method has just like thermal evaporation a pore ability to cover steps which also makes this method ideal for lift-off processes. A noticeable advantage of e-beam evaporation over thermal evaporation is the possibility to add a larger amount of energy into the source material. This yields a higher density film with an increased adhesion to the substrate. Because the electron beam only heats the source material and not the entire crucible, a lower degree of contamination from the crucible will be present than in the case of thermal evaporation. By using a multiple crucible E-beam gun, several different materials can be deposited without breaking the vacuum.The Cryofox electron beam deposition system is a series of vacuum deposition systems that use electron beam deposition. You can get an electron beam deposition system that has either a single or a split chamber. Either form of electron beam deposition system is usable for both small-scale manufacturing of high-end components and for R D projects. The electron beam deposition system can contain up to eight different materials in its sources making it possible to perform advanced multi-layer structures and still maintain the vacuum.
We Topgrid have worked multiple projects on Electron Beam Melting Ebm Here are some examples of Electron Beam Melting Ebm we offer:
Aerospace components
Automotive parts
Medical device implants
Industrial machinery parts
Oil and gas components
Power generation components
Transportation components
High resolution lithography with automation and throughput Shaping the future of Nanoscience
The EBPG5200 is a high performance nanolithography system with full 200 mm writing capability. This Electron Beam Lithography system presents a further evolutionary stage of the highly successful and field-proven EBPG series. It offers a wide range of leading edge solutions for both direct write nanolithography and R D mask making in universities and commercial centers of excellence.
The system is available alongside the EBPG5150 which utilises the same universal plinth platform based on a 155 mm by 155-mm stage platform.
Improved Specifications
Ultra-fast, low-noise pattern generator 125 MHz
Extreme beam current up to 350 nA
Excellent direct write performance with overlay accuracy of 5nm
Highest resolution
Unparalleled automatic calibration and job execution
High current density Thermal Field Emission gun for operation at 20, ¿¿¿50 and 100 kV
200 mm platform for up to 8 inch wafer and 7 inch masks
Minimum feature size of less than 8 nm
Continuously variable large field size operation to 1 mm at all kVs
GUI for ease of use operation for diverse "multi user environment"
Flexible configuration packages to ensure best fit with application requirements